Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener

Abstract

Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications. This study investigates the possible use of 2-hydroxyethyl methacrylate (HEMA) toughening agent and nano-powders, such as alumina, silicon dioxide, and carbon black, to form epoxy composites for dynamic property improvement. Considering the different combinations of the nano-powders and HEMA toughener, the Taguchi method with an L9 orthogonal array was adopted for composition optimization. The dynamic storage modulus and loss tangent of the prepared specimen were measured by employing a dynamic mechanical analyzer. With polynomial regression, the curve-fitted relationships of the glass transition temperature and storage modulus with respect to the design factors were obtained. It was found that although the raise in the weight fraction of nano-powders was beneficial in increasing the rigidity of the epoxy composite, an optimal amount of HEMA toughener existed for its best damping improvement.

Keywords

• electronic packaging
• dynamic storage modulus
• loss tangent
• optimization