Ultrasonic non-destructive evaluation study of molecular diffusion bonding of thin copper-aluminum electrode sheets

Abstract

The weld quality of copper and aluminum thin electrode sheets in molecular diffusion bonding was non-destructively evaluated using ultrasonic resonance techniques. During the welding process, the intermediate layer material nickel diffuses into the molecules of both the copper sheet and aluminum sheet, resulting in the formation of a solid solution phase layer. This leads to a 5-layer structure in the welded body. If there are defects in this solid solution phase layer, it can cause mutations in the ultrasonic resonance signals within the weld body. In order to characterize the weld quality between copper and aluminum sheets, an acoustic attenuation coefficient was introduced. The ultrasonic resonance signals within the weld body of copper and aluminum thin electrode sheets were analyzed under four different welding states. Experimental testing revealed significant differences in acoustic attenuation coefficients among these different welding states. A smaller acoustic attenuation coefficient indicates better welding quality. Therefore, by setting a reasonable threshold for this coefficient, it is possible to effectively evaluate the welding quality of molecular diffusion bonding between copper and aluminum thin electrode sheets.

Keywords

• copper-aluminum thin electrode sheets
• ultrasonic resonance method
• acoustic attenuation coefficient
• molecular diffusion bonding