Effectiveness of Critical-Strain-Based Methodology Considering Elastic Mode Vibration of Mechanical Housing of Electronics

Abstract

A critical-strain-based methodology was proposed to overcome the theoretical limitations of Steinberg’s method, and its effectiveness was experimentally verified through fatigue tests of ball grid arrays, column grid arrays, and lead-type specimens on printed circuit boards (PCBs) with various boundary conditions. These verifications were performed only on PCB units with a single electronic package mounted. However, in actual industrial fields, electronics with various types of electronic packages mounted comprehensively are mainly applied to electronics combined in a mechanical housing structure. Therefore, the verification of the corresponding methodology for the above actual conditions is essential. This study aimed to validate the theoretical feasibility of the design technique under the condition that the elastic mode vibration of a mechanical housing structure acts complexly on PCBs. The proposed methodology was validated analytically and experimentally through a vibration test on a comprehensive PCB specimen with various types of electronic packages mounted on electronic mechanical housing structures.

Keywords

• spaceborne electronics
• solder joint
• launch random vibration
• structural safety
• critical strain