An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

Yini Chen; Jintao Wang; Ziwen Lv; Jianqiang Wang; Feng Tian; Luobin Zhang; Weiwei Zhang; Hongtao Chen; Mingyu Li

Journal of Materials Research and Technology (May 2024)

An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles

Yini Chen,
Jintao Wang,
Ziwen Lv,
Jianqiang Wang,
Feng Tian,
Luobin Zhang,
Weiwei Zhang,
Hongtao Chen,
Mingyu Li

Affiliations

Yini Chen: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Jintao Wang: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; Corresponding author. School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China.
Ziwen Lv: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Jianqiang Wang: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Feng Tian: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Luobin Zhang: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Weiwei Zhang: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Hongtao Chen: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; Corresponding author. School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China.
Mingyu Li: School of Integrated Circuits, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China; State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China; Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China

Journal volume & issue: Vol. 30
pp. 5622 – 5631

Abstract

Read online

To address the demand for multilevel package, a low-melting-point high entropy alloy (HEA) solder was developed. It consists of 43In28Sn14Bi9Zn6Ag micro- and nano-particles with a melting point of about 62.80 °C. We obtained 43In28Sn14Bi9Zn6Ag nanoparticles by combining ultrasonic heating interaction with a ''hot shock'' process. Upon reflowing at 115 °C for 5 min, a Cu/Zn/Ag ternary intermetallic compound (IMC) formed at the interface between the solder and the copper substrate, leading to a shear strength of 40 MPa. The microstructure of this joint exhibits a complex composition with at least three phases, including Bi3In5 phase, Ag5Zn8 phase, and In0.2Sn0.8 solid solution. The stable Ag5Zn8 phase not only enhances the overall strength of the alloy matrix but also impedes the diffusion of In and Bi atoms, thereby preventing the segregation of the Bi3In5 phase. The high mixing entropy and pronounced lattice distortion in this high entropy alloy hinder the diffusion of elements within the solder matrix, mitigating the issue of excessive interfacial IMC growth. Consequently, the solder joints exhibit little degradation even after a high-temperature aging test. This high-entropy alloy solder has promising potential for multi-level chip stacking in 3D packaging.

Published in Journal of Materials Research and Technology

ISSN: 2238-7854 (Print); 2214-0697 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Mining engineering. Metallurgy
Website: https://www.journals.elsevier.com/journal-of-materials-research-and-technology/

About the journal