Mechanical reinforcement with enhanced electrical and heat conduction of epoxy resin by polyaniline and graphene nanoplatelets

Abstract

In this study, the effects of polyaniline (PANI) incorporation (3 wt% of PANI) and graphene nanoplatelets (GNPs) loading (0.1–0.7 wt%) on the mechanical, thermal, and electrical performance of epoxy matrix were investigated. The incorporation of 0.3 wt% GNPs optimally enhanced the bending strength, bending modulus, tensile strength, tensile modulus, and impact strength (90 MPa, 1422 MPa, 63 MPa, 602 MPa, and 8.29 kJm−2, respectively). At 0.3 wt% GNPs, the hybridization effect optimally enhanced the glass transition behaviour of the epoxy nanocomposites. The electrical and thermal conductivities of epoxy were improved upon the inclusion of PANI, and this increase was further augmented when the GNPs content increased to 0.3 wt%. However, higher GNPs contents deteriorated the mechanical performance and electrical and heat conduction. Field emission scanning electron microscopy showed good filler distribution and effective interactions among the GNPs, PANI, and epoxy components with appropriate compositions.

Keywords

• conducting polymer
• nanocomposite
• thermal properties