Nature Communications (Mar 2020)

Efficient strain modulation of 2D materials via polymer encapsulation

  • Zhiwei Li,
  • Yawei Lv,
  • Liwang Ren,
  • Jia Li,
  • Lingan Kong,
  • Yujia Zeng,
  • Quanyang Tao,
  • Ruixia Wu,
  • Huifang Ma,
  • Bei Zhao,
  • Di Wang,
  • Weiqi Dang,
  • Keqiu Chen,
  • Lei Liao,
  • Xidong Duan,
  • Xiangfeng Duan,
  • Yuan Liu

DOI
https://doi.org/10.1038/s41467-020-15023-3
Journal volume & issue
Vol. 11, no. 1
pp. 1 – 8

Abstract

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Strain engineering is a promising method to manipulate properties of two-dimensional (2D) materials but slippage between material and substrate makes strain transfer inefficient. Here the authors overcome slipping effects by encapsulating a 2D material in a polymer substrate.