Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints

Abstract

Sn–Ag solders are widely used for advanced electronic packaging. The combined effect of Ag element and temperature gradient (TG) on the formation of Sn grains in Cu/Sn-xAg/Cu micro solder joints was elucidated systematically. Numerous small-sized β-Sn grains were formed in both Cu/Sn/Cu and Cu/Sn-0.5Ag/Cu micro solder joints after reflow with or without TG. The Cu/Sn-0.5Ag/Cu joint was found to have more twinning β-Sn structures. The formation of the multiple β-Sn grains in these two joints was attributed to the presence of multiple tetrahedral metastable short-range order (SRO) structures which acted as nuclei for the nucleation and growth of β-Sn. The existence of TG slightly enhanced the preferred orientation characteristics of Sn grains. For the joints with Ag content was or higher than 2 wt%, several Sn grains were formed without TG, while a single or highly oriented Sn grains were observed with TG. The number and orientation of Sn grains were affected by the combined effect of Ag element and TG significantly. The β-Sn grains formed without TG were based on the {101} type cyclic twinning configuration clusters that stabilized by Ag atoms and acted as nuclei. The formation of a single or highly preferred β-Sn grains was benefit from the combined effect of Ag element and TG. The results provide theoretical guidance for optimizing the composition of Sn–Ag solders and controlling the microstructure of the joints, thereby contributing to the advancement of electronic packaging technologies.

Keywords

• Advanced packaging
• Sn–Ag solder
• Temperature gradient
• β-Sn grains orientation
• Directional solidification