Tekhnologiya i Konstruirovanie v Elektronnoi Apparature (Oct 2013)

Microassembly on silicon board for accelerometer

  • Spirin V. G.

Journal volume & issue
no. 5
pp. 24 – 27

Abstract

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The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.

Keywords