Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy

Abstract

In order to improve the corrosion resistance of Sn-11In-1.5Ag lead-free solder alloy solder, the corrosion behavior of Sn-11In-1.5Ag-xGa(x=0, 0.1, 0.3, 0.5, 0.7, mass fraction, %) solder alloy in a corrosive environment was studied by weight loss method and electrochemical experiments. In addition, the surface morphologies of Sn-11in-1.5Ag-xGa solder alloy were observed by scanning electron microscopy(SEM), and the corrosion products on the solder surface were characterized by X-ray diffraction(XRD). Results showed that whether in acidic or alkaline solutions, the addition of Ga could improve the corrosion resistance of Sn-11In-1.5Ag solder alloy. With the increase of Ga content, the corrosion resistance of solder was enhanced. For solder alloys with the same composition, their corrosion resistance in alkaline solution was better than that in acid solution. Besides, SEM observation showed that adding Ga into Sn-11In-1.5Ag alloy could significantly reduce the corrosion degree of solder, and XRD analysis disclosed that the corrosion products of solder alloys in acidic and alkaline solutions were the same, both of which were In2O3.

Keywords

• lead -free solder；sn -in -ag alloy；ga；corrosion resistance