3-D microstructure measurement method by using SEM

Abstract

The three-dimensional measurement method by SEM has already been proposed by using the principle of shadow moiré. In this method, there are some troubles in order to perform a high-resolution analysis. A new method based on the principle of projection moiré by SEM is discussed to solve the troubles. In this paper, some shadows of the original grid on the surface of the object by back scattering electron beam are analyzed by using the spatial fringe analysis method and the new 3-D measurement based on a geometric analysis. The validity of the proposed method is confirmed by the experimental results. It is confirmed that the proposed method has a lateral high-resolution power.