The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy

Abstract

Sn-Cu-Ni lead-free solder alloy electrodeposited on copper substrate from a deep eutectic solvent (DES)-based electrolyte under direct current (DC) and pulsed current (PC) was subjected to a reflowing process at the industrial company MIBATRON S.R.L. (Otopeni, Romania). The alteration of the alloy’s composition and anti-corrosive properties upon exposure to the reflow process were investigated via Scanning Electron Microscopy (SEM-EDX), X-ray diffraction (XRD), linear sweep voltammetry (LSV) and electrochemical impedance spectroscopy (EIS). Corrosion studies conducted in sodium chloride solution revealed that the system obtained under the DC plating mode (Sn-Cu-Ni-DC) exhibited enhanced anti-corrosive properties compared to the system obtained under PC (Sn-Cu-Ni-PC) after reflowing. However, prior to reflowing, the opposite effect was observed, with Sn-Cu-Ni-PC showing improved anti-corrosive properties. These changes in anti-corrosive behavior were attributed to the modification of the alloy’s composition during the reflowing process.

Keywords

• Sn-Cu-Ni ternary alloy
• electrodeposition
• reflowing process
• anti-corrosive properties