Studies on the Method of Orthogonal Collocation VI: A Moving Collocation Method for the Solution of the Transient Heat Conduction Problem

Abstract

A new moving collocation method is introduced for solving the problem of time-dependent heat conduction with source term in one dimension. The method is based on dividing the solution domain into active and inactive zones. The numerical results show that the proposed method is able to simulate the sharp profile at short time with very few collocation points as opposed to the global collocation method.