Thermal Analysis of FIMS TDC and LVPS Electronic Boards

Abstract

Electronic boards of Far-ultraviolet IMaging Spectrograph (FIMS) should be designed to maintain their performances, and their temperatures should be remained within the allowed temperatures in operational environments. Thermal analysis at the electronic board level has been performed, and it is confirmed the electronics parts could be kept within their allowed temperature ranges.

Keywords

• finite-elements methods
• electronic boards
• heat transfer