Cailiao gongcheng (Dec 2020)

Research progress in high thermal conductivity diamond/aluminum composites

  • LIU Yuan,
  • CUI Yan,
  • GUO Kai-jin,
  • CAO Lei-gang,
  • YANG Yue

DOI
https://doi.org/10.11868/j.issn.1001-4381.2019.000781
Journal volume & issue
Vol. 48, no. 12
pp. 44 – 52

Abstract

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The mainstream fabrication technologies and the key factors affecting their thermal conductivity of diamond/aluminium composites with high thermal conductivity for thermal manag-ement were reviewed. The vacuum hot pressing sintering, spark plasma sintering, pressureless infiltration, vacuum pressure infiltration and squeeze casting were emphatically introduced, and their advantages and disadvantages as well as their applicability were reviewed. The influence of characteristics of diamond particles, matrix alloy elements and diamond surface coating on the interface configuration and thermal conductivity of diamond/aluminium composites was discussed. It was pointed out that matrix alloying and diamond surface metallization can improve the interface bonding of the composites. In order to improve the thermal conductivity of diamond/aluminium composites, the regulation of interface microstructure and the mechanism of interface heat transfer should be paid more attention to.

Keywords