Scientific Reports (May 2022)

Investigation of ultra-precision planing process to fabricate high luminance retroreflector based on cutting force and tool vibration analysis

  • Ji-Young Jeong,
  • Jun Sae Han,
  • Chung-Mo Kang,
  • Eun-Ji Gwak,
  • Doo-Sun Choi,
  • Tae-Jin Je

DOI
https://doi.org/10.1038/s41598-022-10824-6
Journal volume & issue
Vol. 12, no. 1
pp. 1 – 16

Abstract

Read online

Abstract In ultra-precision planing process, the analysis of the critical depth of cut (DOC) is required to reduce the edge blunt and micro burrs produced by size effect which decreases of the effective area for high luminance retroreflector. However, since the machining characteristics are different according to cutting tool shape, machining material, and cutting condition, determine of the critical DOC is difficult without a comparison of machined surfaces under various DOC measured by ultra-high resolution measuring instrument. In this study, the critical DOC was analyzed using cutting force and tool vibration signals. The specific cutting energy was calculated by cutting force and cross-sectional area to analyze the stress variation according to DOC. Also, acceleration signals were converted to frequency spectrum that analyze dominant vibrating direction of the cutting tool by variation of cutting characteristic. It was confirmed that the method of using tool vibration more effective and accurate than specific cutting energy through validation of the comparison between results from analyze of the vibration signals and direction measuring surfaces. The master mold with area of 250 mm2 was manufactured by applying analyzed critical DOC. In addition, the high luminance characteristic of a retroreflection film press formed by the master mold was confirmed.