APL Materials (Sep 2024)
Roadmap on low-power electronics
- Ramamoorthy Ramesh,
- Sayeef Salahuddin,
- Suman Datta,
- Carlos H. Diaz,
- Dmitri E. Nikonov,
- Ian A. Young,
- Donhee Ham,
- Meng-Fan Chang,
- Win-San Khwa,
- Ashwin Sanjay Lele,
- Christian Binek,
- Yen-Lin Huang,
- Yuan-Chen Sun,
- Ying-Hao Chu,
- Bhagwati Prasad,
- Michael Hoffmann,
- Jia-Mian Hu,
- Zhi (Jackie) Yao,
- Laurent Bellaiche,
- Peng Wu,
- Jun Cai,
- Joerg Appenzeller,
- Supriyo Datta,
- Kerem Y. Camsari,
- Jaesuk Kwon,
- Jean Anne C. Incorvia,
- Inge Asselberghs,
- Florin Ciubotaru,
- Sebastien Couet,
- Christoph Adelmann,
- Yi Zheng,
- Aaron M. Lindenberg,
- Paul G. Evans,
- Peter Ercius,
- Iuliana P. Radu
Affiliations
- Ramamoorthy Ramesh
- Rice University, Houston, Texas 77005, USA
- Sayeef Salahuddin
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, California 94720, USA
- Suman Datta
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
- Carlos H. Diaz
- Corporate Research, Taiwan Semiconductor Manufacturing Company, San Jose, California 95134, USA
- Dmitri E. Nikonov
- Intel Corp, Hillsboro, Oregon 97124, USA
- Ian A. Young
- Intel Corp, Hillsboro, Oregon 97124, USA
- Donhee Ham
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, USA
- Meng-Fan Chang
- Corporate Research, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan
- Win-San Khwa
- Corporate Research, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan
- Ashwin Sanjay Lele
- Corporate Research, Taiwan Semiconductor Manufacturing Company, San Jose, California 95134, USA
- Christian Binek
- Department of Physics and Astronomy and the Nebraska Center for Materials and Nanoscience, University of Nebraska-Lincoln, Lincoln, Nebraska 68588-0299, USA
- Yen-Lin Huang
- Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
- Yuan-Chen Sun
- Industry Academia Innovation School, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
- Ying-Hao Chu
- Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
- Bhagwati Prasad
- Department of Materials Engineering, Indian Institute of Science, Bengaluru, KA 560012, India
- Michael Hoffmann
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, California 94720, USA
- Jia-Mian Hu
- Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA
- Zhi (Jackie) Yao
- Applied Mathematics and Computational Research Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, USA
- Laurent Bellaiche
- Physics Department and Institute for Nanoscience and Engineering, University of Arkansas, Fayetteville, Arkansas 72701, USA
- Peng Wu
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
- Jun Cai
- Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA
- Joerg Appenzeller
- Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA
- Supriyo Datta
- Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, USA
- Kerem Y. Camsari
- Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, California 93106, USA
- Jaesuk Kwon
- Chandra Family Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, USA
- Jean Anne C. Incorvia
- Chandra Family Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, USA
- Inge Asselberghs
- IMEC, Kapeldreef 75, 3001 Leuven, Belgium
- Florin Ciubotaru
- IMEC, Kapeldreef 75, 3001 Leuven, Belgium
- Sebastien Couet
- IMEC, Kapeldreef 75, 3001 Leuven, Belgium
- Christoph Adelmann
- IMEC, Kapeldreef 75, 3001 Leuven, Belgium
- Yi Zheng
- Applied Materials, Santa Clara, California 95054, USA
- Aaron M. Lindenberg
- Stanford Institute for Materials and Energy Sciences, SLAC National Laboratory, Menlo Park, California 94025, USA
- Paul G. Evans
- Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA
- Peter Ercius
- National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, California 94720, USA
- Iuliana P. Radu
- Corporate Research, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan
- DOI
- https://doi.org/10.1063/5.0184774
- Journal volume & issue
-
Vol. 12,
no. 9
pp. 099201 – 099201-73
Abstract
No abstracts available.