Simulation experimental on material removal mechanism of ITO conductive glass by single abrasive

Abstract

To study the removal mechanism of ITO conductive glass materials, this paper uses a single abrasive particle to simulate the cutting process of the materials and establishes a material model for ITO glass. Based on the analysis of processed surface morphology, stress, and cutting force, the material removal mechanism of ITO glass is examined. Additionally, the influence of cutting parameters on cutting force and residual stress is studied and compared with soda-lime glass. The results show that during the cutting process of abrasive particle, material removal is influenced by the ITO film layer, the glass substrate, and cohesive contact behavior, leading to failure forms such as delamination, channel cracking, and interlayer fracture. With the feed of the abrasive particle, the cutting force fluctuates within a certain range, exhibiting a pattern of growth, stability, and decrease. The cutting force of the abrasive particle is positively correlated with both cutting speed and cutting depth. Compared to the glass substrate, the residual stress on the ITO film is larger and fluctuates more dramatically. The presence of the ITO film significantly influences cutting behavior, especially when the cutting depth approaches the thickness of the ITO film.

Keywords

• ito conductive glass
• material removal mechanism
• cutting force
• residual stress