Copper phenyl phosphonate for epoxy resin and cyanate ester copolymer with improved flame retardancy and thermal properties

Abstract

Epoxy resin (EP)/cyanate ester (CE) copolymer, an important structural material with high temperature resistance and low dielectric constant in aerospace, microelectronics, and related fields, is still of great flammability danger. In this work, copper phenyl phosphonate (CuPP), a flame retardant used in EP/CE copolymer was synthesized by the reaction of phenyl phosphonic acid and copper nitrate trihydrate. The fire and thermal behavior of EP/CE/CuPP composites were studied in detail. The results suggested that the UL-94 rating and limiting oxygen index of EP/CE composite with 5 wt% CuPP (EP/CE/CuPP5) reach V-1 level and 30.6%, respectively. Compared with pure EP/CE copolymer, the peak heat release rate and total heat release values of EP/CE/CuPP5 decreased by 34.5% and 18.9%, respectively. The glass transition temperature of EP/CE/CuPP composite is higher than that of pure EP/CE copolymer, suggesting that the fire-retardant composite has higher work temperature and better heat resistance.

Keywords

• copper phenyl phosphonate
• epoxy resin
• cyanate ester
• flame retardant
• thermal properties