Study of robust package strength characterization of memory packages for handheld application

Abstract

In mobile market, the demand of memory packaging increase year over year. While the form factor of memory packages moves toward smaller and thinner geometry with higher pin counts, the package overall mechanical robustness becomes one of a key criteria for mobile companies regarding to consumer usage condition. Package strength is an indicator for package robustness. Package with low strength may likely lead to die cracking or epoxy mold compound (EMC) cracking during assembly, testing, reliability testing or consumer field usage. In this study, comprehensive factors will be covered to discuss the impact on package strength performance. In addition, the failure analysis would be studied aiming to observe initial crack point. Last, the study will discuss about the current testing methodology and will later propose new testing methodologies which are more suitable to field application condition.

Keywords

• Package strength
• Three-point bending
• Drop impact test
• Memory electronic packages
• Mobile application
• Probabilistic mechanics