PHASE FORMATION IN CONTACT LAYERS DURING CONTACT MELTING OF COPPER AND ALUMINUM

Abstract

In this work, an attempt is made to identify the features of the structure of contact layers during the contact melting of copper with aluminum brand AMG-2 (mass composition, %: Mg – 1,8 - 2,8 , Mn – 0,2 - 0,6 , Cu – 0,1 , Zn – 0,2 ,Fe – 0,4 , Si – 0,4 , rest – aluminum) and aluminum-lithium alloy ( Al – 0,4 wt.% ). The study of contact melting in the system is important for development of contact-reactive soldering technology, obtaining layered intermetallic composite materials, creating heat sinks for semiconductor devices, modeling dendrite formation. It was established that intermetallic compounds are formed in the contact layers, which affect the brittleness of copper-aluminum compounds and eutectic structures.

Keywords

• contact melting
• contact interaction
• aluminium/copper system
• euthetics
• phase formation in contact layers