Frontiers in Materials (Jul 2020)

Improved Thermal Resistance and Electrical Conductivity of a Boron-Doped DLC Film Using RF-PECVD

  • Wanrong Li,
  • Xing Yan Tan,
  • Yeong Min Park,
  • Dong Chul Shin,
  • Dae Weon Kim,
  • Tae Gyu Kim

DOI
https://doi.org/10.3389/fmats.2020.00201
Journal volume & issue
Vol. 7

Abstract

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Diamond-like carbon (DLC) film doped with boron has unique properties and displays higher thermal resistance, lower internal stress, and better electrical conductivity than un-doped DLC film; this makes it is suitable for various applications, especially in outer space. Radio-frequency plasma-enhanced chemical vacuum deposition of boron-doped DLC film was performed to determine the optimal percentage of boron for improving thermal resistance. Additional heat treatment and 40 vol% B2H6/CH4 yielded the best electrical conductivity. X-ray photoelectron spectroscopy, thermal gravimetric analysis, Raman spectroscopy, and the four-point probe method were utilized to analyze the properties of boron-doped DLC film. The boron-doped DLC film displayed outstanding performance in terms of thermal resistance and electrical conductivity.

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