Preparation and Performance of Conductive Copper Ink Based on Chemical Deoxidization

Abstract

This paper adopts the improved liquid-phase chemical deoxidization to prepare nano-copper powder used as principal conducting material instead of nano-silver particles in conductive ink of printed electronics. The prepared nano copper particles are analyzed for their microstructure and electrical conductivity. Studies show that the prepared nano-copper particles are mainly distributed chain-like, with an average particle size of 26 nm, of which, those with 20-25nm amount to 42%, 25-30nm to 29%. The PVP surfactant can effectively organize the oxidation of nano-copper. After the sintering temperature exceeds 412°C, the organic materials mixed in the nano-copper have completely volatilized. The content of nano copper decomposition product hits upon 46.5% of the original sample. The higher the sintering temperature, the lower the sheet resistance of the conductive copper film. After the sintering temperature exceeds the melting point of nano-copper, a stable conductivity channel will be formed on the surface of the film. Subsequently, continuous sintering of the film has an insignificant effect on its conductivity.