Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, China
Wenchao Chen
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, China
School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
Guo-Dong Zhu
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, China
School of Electronic Engineering, University of Electronic Science and Technology, Chengdu, China
Pingqi Gao
Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo, China
Jose E. Schutt-Aine
College of Electrical and Computer Engineering, University of Illinois at Urbana–Champaign, Urbana, IL, USA
Wen-Yan Yin
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, China
Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.
