ITM Web of Conferences (Jan 2019)

3D thermal field modelling in electromagnetic gripping system

  • Barański Mariusz,
  • Glapa Krystian

DOI
https://doi.org/10.1051/itmconf/20192801012
Journal volume & issue
Vol. 28
p. 01012

Abstract

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In this paper, 3D steady-state thermal field modeling in electromagnetic gripping system using Comsol Multiphisics was presented. The electromagnetic gripping system, which is a component of the mechanical leg of a walking robot was designed by the authors. An algorithm to design of the electromagnetic gripping was developed. During calculations, the influence of the value of the current on the thermal field distribution in steady-state was carried out. Selected results of simulations as well as the analysis of these results were presented.