Solid solution softening at room temperature and hardening at elevated temperatures: a case by minor Mn addition in a (HfNbTi)85Mo15 refractory high entropy alloy

Abstract

To address the conflict between room-temperature (RT) ductility and high-temperature (HT) strength in single phase bcc-structured refractory high entropy alloys, here we propose to use minor alloying to achieve solid solution softening at RT and simultaneously, solid solution hardening at HT. Our strategy was manifested by minor Mn additions in a RT brittle (HfNbTi) _85 Mo _15 refractory high entropy alloy, where nominal Mn additions ranging from 2 at. % down to 0.03 at. % were seen to soften the base (HfNbTi) _85 Mo _15 alloy at RT, while to harden the base alloy at the temperature range from 400 to 800 °C. The yield stress in all studied alloys showed a three-stage pattern, characterized by a temperature dependent stage at temperatures below 400 °C, followed by a temperature independent stage at intermediate temperatures ranging from 400 to 800 °C, and finally another temperature dependent stage at temperatures higher than 800 °C. The mechanisms for solid solution softening and solid solution hardening in single phase bcc-structured refractory high entropy alloys were discussed, together with their temperature dependence.

Keywords

• refractory high entropy alloys
• solid solution softening and hardening
• solid solutions