CALIBRATION OF THE SYSTEM USED FOR CONDUCTOR INSPECTION AT MICROCHIP SUBSTRATE

Abstract

The article describes the calibration method of the photometric system for a particular purpose of estimation position of the conductor connecting the semiconductor chip and the substrate. A nonlinear model of the camera lens distortion, which allows estimating the position of the conductor in a three-dimensional space with the required accuracy is described. The novelty of the described technique is to provide the required accuracy of conductor parameters measurement with a high processing speed.

Keywords

• калибровка камеры
• точность калибровки
• трехмерная сцена