An Analytical Method for Modelling Pull-In Effect during Anodic Bonding

Abstract

Pull-in effect is a common phenomenon during anodic bonding, a key step in thefabrication processes of capacitive sensors and actuators. To assist the designs and fabrications ofthese transducers, this paper presents an analytical method for modelling the pull-in effect duringanodic bonding. The pull-in effect model was verified by finite element analysis and a verificationexperiment respectively. The verification results indicate that the analytical method for modellingthe pull-in effect during anodic bonding is capable for predicting pull-in voltages of anodicallybonded capacitive sensors and actuators in a universal and practical manner without any additionalfabrication process.

Keywords

• pull-in effect
• anodic bonding
• capacitive transducer