Well-Adhered Copper Nanocubes on Electrospun Polymeric Fibers

Abstract

Electrospun polymer fibers can be used as templates for the stabilization of metallic nanostructures, but metallic species and polymer macromolecules generally exhibit weak interfacial adhesion. We have investigated the adhesion of model copper nanocubes on chemically treated aligned electrospun polyacrylonitrile (PAN) fibers based on the introduction of interfacial shear strains through mechanical deformation. The composite structures were subjected to distinct macroscopic tensile strain levels of 7%, 11%, and 14%. The fibers exhibited peculiar deformation behaviors that underscored their disparate strain transfer mechanisms depending on fiber size; nanofibers exhibited multiple necking phenomena, while microfiber deformation proceeded through localized dilatation that resulted in craze (and microcrack) formation. The copper nanocubes exhibited strong adhesion on both fibrous structures at all strain levels tested. Raman spectroscopy suggests chemisorption as the main adhesion mechanism. The interfacial adhesion energy of Cu on these treated PAN nanofibers was estimated using the Gibbs–Wulff–Kaischew shape theory giving a first order approximation of about 1 J/m2. A lower bound for the system’s adhesion strength, based on limited measurements of interfacial separation between PAN and Cu using mechanically applied strain, is 0.48 J/m2.

Keywords

• nanofibers
• microfibers
• aligned electrospun fibers
• nanostructures
• copper
• adhesion energy