eXPRESS Polymer Letters (Aug 2014)

Superhydrophobic polyimide films with high thermal endurance via UV photo-oxidation

  • L. X. Song,
  • H. Y. Gu,
  • Z. Y. Qi,
  • W. Wu,
  • Y. Zeng

DOI
https://doi.org/10.3144/expresspolymlett.2014.62
Journal volume & issue
Vol. 8, no. 8
pp. 588 – 595

Abstract

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UV photo-oxidation was first applied to fabricate superhydrophobic polyimide (PI) films in combination with fluoroalkylsilane (FAS) modification. During prolonged UV irradiation, commercial flat PI films evolved to form unique micro/nanostructures. Meanwhile, the root mean square (RMS) surface roughness increased from 1.74 to 53.70 nm, leading to a gradual increase of WCA from 105.1 to 159.2° after FAS treatment. After 72 h of UV radiation exposure, the micro/nano-structured and FAS-modified PI films exhibited superhydrophobicity with water contact angle (WCA) larger than 150° and sliding angle (SA) less than 5°. The superhydrophobicity remained even after annealing at 350°C, which enabled stable utilization under elevated temperature. Stable micro/nanostructures and chemical bonding of FAS were found to contribute to the high thermal endurance. Moreover, the formation mechanism of the superhydrophobic PI films was investigated. The proposed UV photo-oxidation method provides a new route for the industrial fabrication of thermally stable superhydrophobic PI films.

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