Bessel Beam Femtosecond Laser Interaction with Fused Silica Before and After Chemical Etching: Comparison of Single Pulse, MHz-Burst, and GHz-Burst

Abstract

We investigate the elongated modifications resulting from a Bessel beam-shaped femtosecond laser in fused silica under three different operation modes, i.e., the single-pulse, MHz-burst, and GHz-burst regimes. The single-pulse and MHz-burst regimes show rather similar behavior in glass, featuring elongated and slightly tapered modifications. Subsequent etching with Potassium Hydroxide exhibits an etching rate and selectivity of up to 606 μm/h and 2103:1 in single-pulse operation and up to 322 μm/h and 2230:1 in the MHz-burst regime, respectively. Interestingly, in the GHz-burst mode, modification by a single burst of 50 pulses forms a taper-free hole without any etching. This constitutes a significant result paving the way for chemical-free, on-the-fly drilling of high aspect-ratio holes in glass.

Keywords

• Bessel beam
• GHz-burst mode
• laser processing
• dielectrics
• chemical etching
• laser drilling