Data in Brief (Dec 2017)

Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment

  • Safdar Abbas Malik,
  • Le Thanh Hung,
  • Ngo Van Nong

Journal volume & issue
Vol. 15
pp. 97 – 101

Abstract

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The data presented in this article are related to the research article entitled: “Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes” (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.