Creep Behavior Characterization of Nickel-Based Single-Crystal Superalloy DD6 Thin-Walled Specimens Based on a 3D-DIC Method

Abstract

The thickness debit effect of creep behavior has been a focal point of nickel-based single-crystal superalloy research, and there is a need for an advanced creep deformation measurement method. This study developed a novel high-temperature creep test system based on a single-camera stereo digital image correlation (DIC) method with four plane mirrors to conduct creep tests on thin-walled specimens of a nickel-based single-crystal alloy, DD6, with thicknesses of 0.6 mm and 1.2 mm under experimental conditions of 980 °C/250 MPa. The reliability of the single-camera stereo DIC method in measuring long-term deformation at a high temperature was experimentally verified. The experimental results show that the creep life of the thinner specimen was significantly shorter. It was found the lack of coordination in the creep deformation process of the edge and middle section of the thin-walled specimens may be an important factor in the thickness debit effect according to the full-field strain contour. By comparing the local strain curve at the rupture point with the average creep strain curve, it was found that the creep rate at the rupture point was less affected by the specimen thickness during the secondary creep stage, while the average creep rate in the working section significantly increased as the wall thickness decreased. The thicker specimen usually had a higher average rupture strain and higher damage tolerance, which prolonged the rupture time.

Keywords

• creep
• single-crystal superalloy
• thickness debit effect
• digital image correlation