Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review
Md. Abdul Alim,
Mohd Zulkifly Abdullah,
Mohd Sharizal Abdul Aziz,
R. Kamarudin,
Prem Gunnasegaran
Affiliations
Md. Abdul Alim
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
Mohd Zulkifly Abdullah
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
Mohd Sharizal Abdul Aziz
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
R. Kamarudin
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
Prem Gunnasegaran
Department of Mechanical Engineering, College of Engineering, Universiti Tenaga Nasional, Putrajaya Campus, Jalan IKRAM-UNITEN, Kajang 43000, Selangor, Malaysia
The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.
