Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

Chin-Hao Tsai; Han-Tang Hung; Fu-Ling Chang; Steffen Bickel; Maik Müller; Iuliana Panchenko; Karlheinz Bock; C.R. Kao

Journal of Materials Research and Technology (Jul 2022)

Low-temperature transient liquid phase bonding via electroplated Sn/In–Sn metallization

Chin-Hao Tsai,
Han-Tang Hung,
Fu-Ling Chang,
Steffen Bickel,
Maik Müller,
Iuliana Panchenko,
Karlheinz Bock,
C.R. Kao

Affiliations

Chin-Hao Tsai: Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Han-Tang Hung: Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Fu-Ling Chang: Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
Steffen Bickel: Institute of Electronics Packaging Technology, Technische Universität Dresden, Dresden, Germany
Maik Müller: Institute of Electronics Packaging Technology, Technische Universität Dresden, Dresden, Germany
Iuliana Panchenko: Institute of Electronics Packaging Technology, Technische Universität Dresden, Dresden, Germany
Karlheinz Bock: Institute of Electronics Packaging Technology, Technische Universität Dresden, Dresden, Germany
C.R. Kao: Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan; Corresponding author.

Journal volume & issue: Vol. 19
pp. 2510 – 2515

Abstract

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Sn/In–Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids were formed at the interfaces after bonding, the In–Sn metallization enabled low-temperature bonding due to the low eutectic temperature. A bonding mechanism to achieve this novel In–Sn low-temperature assembly was also proposed.

Published in Journal of Materials Research and Technology

ISSN: 2238-7854 (Print); 2214-0697 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Mining engineering. Metallurgy
Website: https://www.journals.elsevier.com/journal-of-materials-research-and-technology/

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