RealPi2dDIC: A low-cost and open-source approach to In-situ 2D Digital Image Correlation (DIC) applications
Partha Pratim Das,
Muthu Ram Prabhu Elenchezhian,
Vamsee Vadlamudi,
Kenneth Reifsnider,
Damien André,
Rassel Raihan
Affiliations
Partha Pratim Das
Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, Arlington, TX 76019, USA; Institute for Predictive Performance Methodologies, University of Texas at Arlington Research Institute, Fort Worth, TX 76118, USA; Corresponding authors.
Muthu Ram Prabhu Elenchezhian
Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, Arlington, TX 76019, USA; Institute for Predictive Performance Methodologies, University of Texas at Arlington Research Institute, Fort Worth, TX 76118, USA
Vamsee Vadlamudi
Institute for Predictive Performance Methodologies, University of Texas at Arlington Research Institute, Fort Worth, TX 76118, USA
Kenneth Reifsnider
Institute for Predictive Performance Methodologies, University of Texas at Arlington Research Institute, Fort Worth, TX 76118, USA
Damien André
Univ. Limoges, IRCER, UMR CNRS 7315, 87000 Limoges, France
Rassel Raihan
Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, Arlington, TX 76019, USA; Corresponding authors.
In this current work an open-source 2D Digital Image Correlation (DIC) tool, RealPi2dDIC, is presented to monitor in-situ full field deformation and strain responses of structures during loading. This software is coded in Python3 and uses Raspberry Pi as the computation and Pi camera as the imaging device. This low-cost approach to in-situ DIC analysis enables its application in a broad field of research and industry problems where 2D strain field tensor is one of the principal interests of study. This code is provided with an interactive user interface (UI) making it user friendly and easy-to-use. Furthermore, RealPi2dDIC offers a simple software architecture which can be adopted, modified and extended to suit users’ purpose.