Feed Integration and Packaging of a Millimeter-Wave Antenna Array

Abstract

A novel approach is presented and demonstrated for integrating a wideband vertically fed antenna array at Millimeter-Wave (mm-Wave) frequencies. Specifically, a novel cost-effective Antenna-In-Package (AiP) fabrication approach is presented, then a prototype operating from 55 GHz to 64 GHz is built while predicted performance is verified via measurements. The presented approach relies on separating fabrication into 1) the array and 2) the back-end feeding board. Assembly of the various components is achieved through several precision microfabrication steps utilizing a Ball-Grid-Array (BGA) technology with thermally stable conductive solder paste. The paper describes the realization of the final AiP aperture in terms of design tolerances, laboratory equipment, component placement and alignment, curing time duration and temperature ranges, and prototype on-the-go testing.

Keywords

• Antenna-in-package (AiP)
• ball-grid-array (BGA)
• millimeter-wave (mm-Wave)
• wideband antenna array