Automation of a PCB Reflow Oven for Industry 4.0

Abstract

With the rise of Industry 4.0, its pillars (which include Internet of Things, “Big Data”, data analytics, augmented reality, cybersecurity, etc.) have become unavoidable tendencies for the automated manufacturing industry. Equipment upgrade is required to match the new standards of digitally assisted automation. However, not all factories in the medium to small range (or independent manufacturers) can afford to upgrade their equipment. Therefore, the availability of affordable Industry 4.0 upgrades for now-outdated devices is necessary for manufacturers in the SME range (Small-Medium Enterprises) to stay relevant and profitable. More specifically, this work revolves around the automation of printed circuit board (PCB) manufacturing, which is one of the most popular and profitable areas involved in this movement; and within it, the large majority of manufacturing defects can be traced to the soldering or “reflow” stage. Manufacturing research must, thus, aim towards improving reflow ovens and, more specifically, aim to improve their autonomous capabilities and affordability. This work presents the design and results of a controlling interface utilizing a Raspberry Pi 4 as a coupling interface between an MQTT Broker (which monitors the overall system) and the oven itself (which is, intentionally, a sub-prime model which lacks native IoT support), resulting in successful, remote, network-based controlling and monitoring of the oven. Additionally, it documents the design and implementation of the network adaptations necessary for it to be considered a cybersecure IIoT Module and connect safely to the Production Cell’s Subnet. All of this to address the inclusion of specific Industry 4.0 needs such as autonomous functioning, data collection and cybersecurity in outdated manufacturing devices and help enrich the processes of SME PCB manufacturers.

Keywords

• Industry 4.0
• PCB manufacturing
• IIoT
• reflow oven
• soldering
• Raspberry Pi