Nature Communications (Mar 2021)
Sub-thermionic, ultra-high-gain organic transistors and circuits
- Zhongzhong Luo,
- Boyu Peng,
- Junpeng Zeng,
- Zhihao Yu,
- Ying Zhao,
- Jun Xie,
- Rongfang Lan,
- Zhong Ma,
- Lijia Pan,
- Ke Cao,
- Yang Lu,
- Daowei He,
- Hongkai Ning,
- Wanqing Meng,
- Yang Yang,
- Xiaoqing Chen,
- Weisheng Li,
- Jiawei Wang,
- Danfeng Pan,
- Xuecou Tu,
- Wenxing Huo,
- Xian Huang,
- Dongquan Shi,
- Ling Li,
- Ming Liu,
- Yi Shi,
- Xue Feng,
- Paddy K. L. Chan,
- Xinran Wang
Affiliations
- Zhongzhong Luo
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Boyu Peng
- Department of Mechanical Engineering, The University of Hongkong, Pok Fu Lam Road
- Junpeng Zeng
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Zhihao Yu
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Ying Zhao
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences
- Jun Xie
- Department of Cardiology, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School
- Rongfang Lan
- Department of Cardiology, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School
- Zhong Ma
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Lijia Pan
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Ke Cao
- Department of Mechanical Engineering, City University of Hong Kong, Kowloon
- Yang Lu
- Department of Mechanical Engineering, City University of Hong Kong, Kowloon
- Daowei He
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Hongkai Ning
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Wanqing Meng
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Yang Yang
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Xiaoqing Chen
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Weisheng Li
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Jiawei Wang
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences
- Danfeng Pan
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Xuecou Tu
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Wenxing Huo
- Department of Biomedical Engineering, Tianjin University
- Xian Huang
- Department of Biomedical Engineering, Tianjin University
- Dongquan Shi
- Department of Sports Medicine and Adult Reconstructive Surgery, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School
- Ling Li
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences
- Ming Liu
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences
- Yi Shi
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Xue Feng
- AML, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University
- Paddy K. L. Chan
- Department of Mechanical Engineering, The University of Hongkong, Pok Fu Lam Road
- Xinran Wang
- National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- DOI
- https://doi.org/10.1038/s41467-021-22192-2
- Journal volume & issue
-
Vol. 12,
no. 1
pp. 1 – 9
Abstract
Exploiting negative capacitance effects in organic thin-film transistors (OTFTs) is advantageous for enhancing device performance. Here, the authors report solution-processed sub-thermionic OTFTs and circuits with ferroelectric hafnium oxides that show ultra-low power and ultra-high gain.
