TSV‐based common‐mode noise‐suppressing filter design and implementation

Abstract

Abstract A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits. A differential fifth‐order T‐model low‐pass filter prototype circuit for transmission lines with common inductance is used to characterize and design the stopband and the corresponding two transmission zeros for the common mode (CM). The circuit parameters are carefully designed and calculated to fit the performance requirement. The TSV‐CMF is implemented in an interposer process with TSV as the vertical connect and redistribution layer (RDL) as the capacitance and inductance. TSV‐CMF samples are tested, and the measurement results match those of the full‐wave simulation. The differential cut‐off frequency of the TSV‐CMF can reach 16 GHz, and the CM stopband is around 5.3–16.0 GHz with 100% fractional bandwidth.