Journal of Materials Research and Technology (Nov 2024)

The electrochemical corrosion behavior and antibacterial properties of Cu-xFe alloy

  • Yanggang Wang,
  • Hui Wu,
  • Lin Su,
  • Meng Wang,
  • Yanbin Jiang,
  • Shen Gong,
  • Zian Xiao,
  • Zhou Li

Journal volume & issue
Vol. 33
pp. 698 – 713

Abstract

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Copper-based alloys have garnered significant attention for their potential in antimicrobial applications aimed at mitigating medical-related infections. Nonetheless, the alloying elements in conventional copper alloys frequently exhibit biotoxicity. This study explored the corrosion behavior, antimicrobial activity, and ion release of Cu–Fe alloys with varying iron contents and aging treatment. The results indicate that increasing the iron content in Cu–Fe alloys and applying appropriate aging treatment can enhance both the antibacterial efficiency and corrosion rate. Transmission electron microscopy (TEM) observations revealed a corrosion mechanism in which dispersed iron phases act as nucleation sites. These nanoscale precipitates increase the Cu/Fe interfacial area, thereby promoting ion release at the interface. Furthermore, in-situ scanning electron microscopy (SEM) revealed that corrosion products are more likely to detach in iron-rich segregated areas, which effectively promotes the sustained release of copper ions.

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