Techno-economic feasibility analysis of an extreme heat flux micro-cooler
Ercan M. Dede,
Chi Zhang,
Qianying Wu,
Neda Seyedhassantehrani,
Muhammad Shattique,
Souvik Roy,
James W. Palko,
Sreekant Narumanchi,
Bidzina Kekelia,
Sougata Hazra,
Kenneth E. Goodson,
Roman Giglio,
Mehdi Asheghi
Affiliations
Ercan M. Dede
Electronics Research Department, Toyota Research Institute of North America, Ann Arbor, MI, USA; Corresponding author
Chi Zhang
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA; School of Integrated Circuits, Peking University, Beijing 100871, P.R. China
Qianying Wu
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Neda Seyedhassantehrani
Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Muhammad Shattique
Department of Materials and Biomaterials Science and Engineering, University of California-Merced, Merced, CA, USA
Souvik Roy
Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
James W. Palko
Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Sreekant Narumanchi
National Renewable Energy Laboratory, Golden, CO, USA
Bidzina Kekelia
National Renewable Energy Laboratory, Golden, CO, USA
Sougata Hazra
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Kenneth E. Goodson
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Roman Giglio
Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Mehdi Asheghi
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA; Corresponding author
Summary: An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.
