Techno-economic feasibility analysis of an extreme heat flux micro-cooler

Ercan M. Dede; Chi Zhang; Qianying Wu; Neda Seyedhassantehrani; Muhammad Shattique; Souvik Roy; James W. Palko; Sreekant Narumanchi; Bidzina Kekelia; Sougata Hazra; Kenneth E. Goodson; Roman Giglio; Mehdi Asheghi

iScience (Jan 2023)

Techno-economic feasibility analysis of an extreme heat flux micro-cooler

Ercan M. Dede,
Chi Zhang,
Qianying Wu,
Neda Seyedhassantehrani,
Muhammad Shattique,
Souvik Roy,
James W. Palko,
Sreekant Narumanchi,
Bidzina Kekelia,
Sougata Hazra,
Kenneth E. Goodson,
Roman Giglio,
Mehdi Asheghi

Affiliations

Ercan M. Dede: Electronics Research Department, Toyota Research Institute of North America, Ann Arbor, MI, USA; Corresponding author
Chi Zhang: Department of Mechanical Engineering, Stanford University, Stanford, CA, USA; School of Integrated Circuits, Peking University, Beijing 100871, P.R. China
Qianying Wu: Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Neda Seyedhassantehrani: Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Muhammad Shattique: Department of Materials and Biomaterials Science and Engineering, University of California-Merced, Merced, CA, USA
Souvik Roy: Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
James W. Palko: Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Sreekant Narumanchi: National Renewable Energy Laboratory, Golden, CO, USA
Bidzina Kekelia: National Renewable Energy Laboratory, Golden, CO, USA
Sougata Hazra: Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Kenneth E. Goodson: Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Roman Giglio: Department of Mechanical Engineering, University of California-Merced, Merced, CA, USA
Mehdi Asheghi: Department of Mechanical Engineering, Stanford University, Stanford, CA, USA; Corresponding author

Journal volume & issue: Vol. 26, no. 1
p. 105812

Abstract

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Summary: An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.

Published in iScience

ISSN: 2589-0042 (Online)
Publisher: Elsevier
Country of publisher: United States
LCC subjects: Science
Website: http://www.cell.com/iscience/home

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