Long Term Creep Assessment of Room-temperature Cured Epoxy Adhesive by Time-stress Superposition and Fractional Rheological Model

Abstract

The creep behavior of a new type epoxy resin adhesive which is room-temperature cured and used for reinforcing engineering structures was studied. The tensile strength of the adhesive has reached the desired values for the structural adhesive used for bonding concrete as the base material with steel. The short-term creep tests were conducted under four different stress levels. The generalized curve for reference stress was obtained by utilizing the time-stress equivalent principle. Moreover, compared with traditional Burgers model, an improved fractional KBurgers model obtained by replacing the Newton derivative with the fractional derivative element (Abel component) in the traditional Burgers model can capture the creep behavior of this epoxy adhesive with high precision in the condition of the room-temperature and tensile stress of 36 MPa.

Keywords

• epoxy resin adhesive
• creep
• time-stress equivalence principle
• kburgers model