APPLICATION OF STATISTICAL METHODS EVALUATION OF THE RELIABILITY OF PRINTED CIRCUIT BOARDS

Abstract

Background. In modern electronic equipment, printed circuit boards are the main component and play an important role in combining all electronic elements to perform the specified functions of the device. The process of producing printed circuit boards is quite complex and includes several stages, each of which consists of a specific set of works. The occurrence of technological defects is possible at any stage and is associated with production conditions, equipment, materials, qualification of staff, etc. Therefore, taking into account and analyzing all emerging defects for timely changes and adjustments to the technological process of printed circuit board production in order to prevent the release of low-quality products become especially important. Materials and methods. The article discusses such methods of processing and analyzing statistical data on technological defects as constructing Ishikawa`s diagrams, Pareto`s diagrams, and ABC analysis. The application of these methods made it possible to identify the main types of defects in printed circuit boards according to the manufacturer’s data. Results. The results of evaluating the quality of printed circuit boards using statistical methods of analysis are presented. A classification of technological defects in printed circuit boards is proposed and possible causes of their occurrence are formulated. Conclusions. The recommended procedure for monitoring technological defects of printed circuit boards will improve the quality of products by identifying and minimizing the causes leading to its maximum reduction. The main directions of work in the field of quality improvement are also given, allowing to eliminate the causes of the most significant defects of printed circuit boards.

Keywords

• printed circuit board
• defect
• technological process
• quality control
• mathematical and statistical methods
• pareto diagram