Bulletin of the Polish Academy of Sciences: Technical Sciences (May 2021)

Multiparameter reliability model for SiC power MOSFET subjected to repetitive thermomechanical load

  • Sebastian Bąba

DOI
https://doi.org/10.24425/bpasts.2021.137386
Journal volume & issue
Vol. 69, no. 3

Abstract

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The main drawback of any Design for Reliability methodology is lack of easy accessible reliability models, prepared individually for each critical component. In this paper, a reliability model for SiC power MOSFET in SOT – 227 B housing, subjected to power cycling, is presented. Discussion covers preparation of Accelerated Lifetime Test required to develop such reliability model, analysis of semiconductor degradation progress, samples post-failure analysis and identification of reliability model parameters. Such model may be further used for failure prognostics or useful lifetime estimation of High Performance Power Supplies.

Keywords