About «technological» properties of nano-sized nickel and copper films

Abstract

As an example of studying morphology of the relief of nickel and copper nano-sized films on the mica surface, it is possible to create a technology to «grow» structures with a given surface morphology using a scanning tunneling microscope. The characteristic features of the film surface nanorelief are described, including fractal properties. The current-voltage characteristics of a metal-to-metal contact for nickel and copper films with a tungsten tip are obtained. It is shown that for surface areas containing fractal structures, the current-voltage characteristics may differ from the dependences obtained on ordinary surfaces.

Keywords

• scanning tunneling microscopy
• nanorelief
• fractal dimension
• nanoscale films of nickel and copper
• current-voltage characteristic
• tunnel contact