AIP Advances (Sep 2019)

Low-energy mass-selected ion beam deposition of silicon carbide with Bernas-type ion source using methylsilane

  • Satoru Yoshimura,
  • Satoshi Sugimoto,
  • Takae Takeuchi,
  • Kensuke Murai,
  • Masato Kiuchi

DOI
https://doi.org/10.1063/1.5116614
Journal volume & issue
Vol. 9, no. 9
pp. 095051 – 095051-4

Abstract

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Methylsilane-derived fragment ions obtained from a Bernas-type ion source were investigated using a low-energy mass-selected ion beam system. Based on mass-energy analyzer measurements, these ions were determined to be H+, H2+, H3+, CH3+, Si+, and SiCH5+. The SiCH5+ ions were selected and injected into a Si(111) substrate at 750 °C. The ion energy was 40 eV. This injection led to the formation of a silicon carbide film on the Si substrate. An analysis of this film indicates that this type of ion beam deposition method can efficiently form silicon carbide film.