Modelling of Void Collapse with Molecular Dynamics in Pure Sn

Abstract

This work simulates the collapse of a spherical void in pure Sn during melting using molecular dynamics (MD). Simulations were performed for two temperatures with a modified embedded atom method (MEAM) potential, which was reported to be in good agreement with respect to melting point and elastic constants. Solutions of the Rayleigh–Plesset (RP) equation are used for comparison under the assumption of macroscopic surface tension and liquid viscosity. Despite a qualitative correlation, longer collapse times were observed in MD simulations, which arose from partial solid structures and the incubation time for melting.

Keywords

• liquid-assisted healing
• Rayleigh–Plesset
• tin
• molecular dynamics