Microstructural effects of copper deposits on direct bonding for 3D IC integration

Abstract

Cu-to-Cu direct bonding has been regarded as an important approach to achieve three-dimensional integrated circuit integration. This study aims to investigate the effects of microstructure and Xenon flash exposure on the direct bonding of copper deposits. Copper electrodeposits, along with a sputtered deposit, with various grain sizes, preferred orientations, as well as surface hardnesses, were prepared to clarify the influence of individual factors quantitatively. Experimental results show that joint strength and grain boundary density followed a positively linear relationship regardless of other microstructural differences, suggesting the dominating role of grain boundary diffusion. Grain refinement can effectively enhance bonding strength, even only one side of the directly bonded joints possessed fine grains. Considering the portable device applications which may suffer from drop shocks, drop testing of the packages comprising sputtered copper on Si chips joined with electroplated copper on Al2O3 substrates assembled by thermal compression bonding was performed for the first time. Noticeably, a proper flash irradiaiton prior to bonding brought about not only remarkable improvement in shear strength by up to 60 % but also drop resistance for direct-copper bonds. The resistance against drop shock for directly-bonded daisy chains subjected to an appropriate light exposure prior to bonding was superior than the joints bonded using impact-resistant solders.

Keywords

• Thermal compression bonding
• Copper electrodeposition
• Direct copper bonding
• Microstructure
• Light irradiaiton
• Drop test