Design and Key Technologies of High-power Press-pack IGBT Device

Abstract

It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the dielectric strength of contacting media. Influence of pressure distribution was introduced along with several solutions, and several optimized thermal deign and fail to short-circuit mechanism were analyzed. In the end, silver sintering, integrated cooler and SiC press-pack were introduced as its future technical trends.

Keywords

• press-pack IGBT
• insulation and withstand voltage
• even pressure distribution
• thermal design
• fail to short-circuit