Optimization of ink-jet technology for PCB interconnects fabrication

Abstract

The effects constraining the quality and resolution of ink-jet silver colloid printing of interconnections are considered. Authors suggest the preliminary surface treatment for spreading minimization and the quality improvement by means of substrate heating and implementation of time delay for multilayer printing. Conductive tracks printing with thickness 30—40 µm was carried out.

Keywords

• jetting technology
• nanoparticles
• conductive tracks